希荻微(688173.SH):預計2023年第二季度開始半導體市場會開始逐步恢復動力
格隆匯6月2日丨希荻微(688173.SH)於2023年5月5日8:30-9:30召開電話會議,問答環節中,就“請問公司對目前半導體週期節奏的展望如何?”,公司回覆稱,目前海外半導體週期相對國內來説較為緩慢,國內半導體市場需求強烈,競爭態勢嚴峻,希荻微在追求更高效率、更高功率的產品的同時,亦在適應國內的市場環境提升成本優勢。公司預計2023年第二季度開始半導體市場會開始逐步恢復動力。
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