日本政府为台积电晶片研发拨款190亿日圆
日本经济产业省表示,将拨款约190亿日圆(约1.7亿美元)协助台积电(TSM.US)在日本进行晶片制造技术研究开发,包括Ibiden及旭化成等逾20间日企亦会参与。
台积电今年2月宣布将在日本设立新基地,预计今次的新研发计划将能进一步提高尖端半导体性能的技术。
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