曠達科技(002516.SZ)：收購日本電波半導體資產事項通過日本政府審批
格隆匯10月9日丨曠達科技(002516.SZ)公佈，公司全資子公司曠達新能源投資有限公司及其下屬公司常州曠達富辰產業投資有限責任公司投資的合夥企業嘉興嘉望投資合夥企業(有限合夥)(下稱“嘉興嘉望”)與Nihon Dempa Kogyo Co.，Ltd.(下稱“NDK”)於2020年6月3日簽訂Share Purchase Agreement(股份購買協議)及Joint Venture Agreement(合資協議)，由嘉興嘉望直接或者指定的關聯公司分兩個批次購買NDK新設立公司NDK SAW devices Co., Ltd.(下稱“NDK SAW”)合計75%的股權。
為順利實施對NDK SAW的投資，公司下屬合夥企業嘉興曠達瀾辰投資合夥企業(有限合夥)與嘉興嘉望成立境內合資公司芯投微電子科技(上海)有限公司(下稱“芯投微”)，擬以芯投微通過ODI(Overseas Direct Investment)方式執行相關境外投資。
根據協議約定：雙方在不影響協議規定的一般性的前提下，應盡最大努力在2020年8月底前完成第一批次交割，最長不超過股份購買協議簽訂後的9個月(除非雙方另有約定)。受全球新冠肺炎蔓延導致的日本政府審批進程放緩等影響，截至2020年8月底，該次交易事項尚未通過日本政府的相關審查，因此雙方交割的先決條件未全部滿足。
該次交易事項由日本經濟產業省(“METI”)進行實質審查並作出預審批後，向財務省(“MOF”)提交最終審批申請。在獲得財務大臣批准後，由日本銀行(“BOJ”)為窗口對外公告審查通過信息。2020年10月9日，芯投微收到經BOJ簽發的三份《取得股份、股權、表決權或行使表決權的權限等或全權投資股份的書面通知》。因此，該次交易事項中協議約定的第一批次股權轉讓、第一批次股權轉讓後的第一次注資及第二批次股權轉讓均通過日本政府的審批。
該次交易事項已通過日本政府審批，協議雙方將根據協議約定的方式儘快完成相關手續，進行第一批次的股權交割，最終交割情況將另行披露。
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