惠倫晶體(300460.SZ):擬投建基於半導體工藝新型高基頻超小型頻率元器件項目
格隆匯 7 月 30日丨惠倫晶體(300460.SZ)公佈,基於重慶在電子信息產業集羣、要素成本、營商環境等方面的優勢逐漸凸顯,從長遠發展戰略考慮,結合公司實際情況及擴大業務規模的內在需求,公司與重慶市萬盛經濟技術開發區管理委員會簽訂項目投資協議,加大在重慶的投資佈局。該協議已經公司第三屆董事會第十五次會議審議通過,仍需提交公司股東大會審議。
項目名稱:基於半導體工藝新型高基頻超小型頻率元器件項目;
項目選址:項目計劃使用國有建設用地約98畝,其中:工業建設用地約87畝,選址擬定萬盛經開區魚田堡高新產業園區;配套居住用地約11畝,選址擬定城市西區奧林匹克公園西門地塊,具體以當地土地管理部門出讓土地的紅線範圍為準。
投資規模:項目計劃投資總額約12.38億元人民幣,總建設週期5年,按照總體規劃、分期實施原則予以建設。
建設內容:主要包括土地購置、廠房建設及設備投入等,用於生產小尺寸高基頻壓電晶體頻率元器件產品,以滿足5G和物聯網對小尺寸、高頻化晶體頻率元器件產品的需求,實現高、中端諧振器、振盪器的進口替代。
項目效益:整個項目建成達產後預計實現年產值約18億元,年納税約1.2億元。
公司擬定全資子公司惠倫晶體(重慶)科技有限公司作為實施本項目的主體。
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