报道指华为新型号手机已无使用美国零部件
《华尔街日报》报道,根据瑞银分析及日本一科研机构报道所得,华为早前推出之新机种Mate 30并无使用美国零部件,其较旧型号之Mate 30之声音晶片仍由美国企业Cirrus Logic供货,较新型号已采用荷兰供应商NXP Semiconductors NV的晶片。
虽华为并非完全不使用美国企业生产之晶片,惟已减少对美国供应商之依赖,甚至自5月推出的手机已无使用美国晶片,即其Y9 Prime及Mate型号手机。
报道引述华为发言人表示,公司明确表示有意继续使用美国零部件,惟若美国政府之决定导致情况不许可,将会寻求其他非美国零部件供应。
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