聖邦股份(300661.SZ)半年度淨利潤升47.19%至6030.49萬元
格隆匯8月15日丨聖邦股份(300661.SZ)發佈2019年半年度報告，實現營業收入2.96億元，同比增長3.99%；歸屬於上市公司股東的淨利潤6030.49萬元，同比增長47.19%；歸屬於上市公司股東的扣除非經常性損益後的淨利潤5804.24萬元，同比增長50.11%；基本每股收益0.5833元。
報告期內，公司持續加強對傳統及新興市場的推廣力度。在通訊設備、消費類電子產品、工業控制、醫療儀器和汽車電子領域持續跟進、積極拓展。同時，公司產品在物聯網、智能家居、智能製造、新能源等新興市場的推廣也取得了良好進展，促進了公司營業收入的增長。
根據公司總體戰略佈局，結合市場的發展趨勢，不斷加強公司的技術研發和技術創新能力，持續進行核心技術的研發。報告期內，公司研發費用為5427.65萬元，佔公司營業收入的18.35%。公司按計劃順利推進各項新產品的研發，完成了近百款新產品的研發，涵蓋信號鏈及電源管理兩大產品領域。其中，信號鏈產品包括高性能運算放大器、模擬開關等；電源管理產品則涵蓋LED驅動芯片、LDO、DC/DC轉換器等多系列產品。隨着物聯網、可穿戴式設備、智能家居、新能源等新興市場的快速發展，各類智能設備對芯片性能的要求也在不斷提高。公司根據相關市場需求的變化趨勢，基於公司芯片產品在高性能、低功耗、小尺寸、高可靠性等方面的技術積累和優勢進行了相關新產品的規劃，展開了相應的研發工作，特別是針對智能終端顯示屏背光LED驅動、高效低功耗DC/DC電源轉換、低噪聲大電流小尺寸LDO等產品方向推出了一批達到世界先進水平的新型模擬芯片產品，如應用於智能手機、PAD的支持串並聯的高壓LED背光驅動芯片、輸出電流可達500mA的低壓差(150mV)線性穩壓器等。另外，在製造工藝方面，公司新一代產品已完成了向0.18u m製程的高壓BCD工藝平台的過渡，這一工藝平台將有助於進一步降低芯片功耗、減小芯片面積，更適用於新一代消費類電子產品、物聯網、移動智能終端等領域。在封裝工藝方面，除了傳統的SOT、DFN、QFN封裝工藝外，越來越多的產品採用WLCSP封裝以減小體積、提升性能，更加適用於便攜式的智能移動終端產品。
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